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1 Ergebnisse
1
Evaluation of Vapor Pressure Induced Debonding Failure in F..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Chen, Bo-Shuo
;
Chiu, Tz-Cheng
;
Yin, Wei-Jie
.. - p. 150-156 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00034
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Evaluation of Vapor Pressure Induced Debonding Failure in Fan-Out Package Under Reflow Condition</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565144&Exemplar=1&LAN=DE A1 Chen, Bo-Shuo A1 Chiu, Tz-Cheng A1 Yin, Wei-Jie A1 Kao, Chin-Li A1 Hung, Chih-Pin YR 2024 SN 2377-5726 K1 Temperature measurement K1 Degradation K1 Adhesives K1 Force K1 Moisture K1 Electronic packaging thermal management K1 Thermal force K1 moisture diffusion K1 delamination K1 underfill K1 fracture toughness SP 150 OP 156 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00034 DO https://doi.org/10.1109/ECTC51529.2024.00034 SF ELIB - SuUB Bremen
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