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1 Ergebnisse
1
Novel Inorganic IR Release Process for High Temperature W2W..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Urban, Peter
;
Povazay, Boris
;
Uhrmann, Thomas
... - p. 415-419 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00073
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Novel Inorganic IR Release Process for High Temperature W2W and D2W Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565145&Exemplar=1&LAN=DE A1 Urban, Peter A1 Povazay, Boris A1 Uhrmann, Thomas A1 Gruber, Michael Josef A1 Thallner, Bernd A1 Wimplinger, Markus YR 2024 SN 2377-5726 K1 Temperature sensors K1 Semiconductor device reliability K1 Silicon K1 Pulsed laser deposition K1 Bonding K1 Standards K1 Three-dimensional integrated circuits K1 W2W K1 D2W integration K1 IR Release Process K1 High Temperature Stable Temporary Bonding SP 415 OP 419 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00073 DO https://doi.org/10.1109/ECTC51529.2024.00073 SF ELIB - SuUB Bremen
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