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1 Ergebnisse
1
Study of Stress and Warpage Estimate of FOWLP under Hygro-T..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Huang, Yu-Wei
;
Kumar Yadav, Ruchi Ashok
;
Lin, Hong-Yu
.. - p. 1599-1602 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00261
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Study of Stress and Warpage Estimate of FOWLP under Hygro-Thermal Coupling Loading Condition</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565147&Exemplar=1&LAN=DE A1 Huang, Yu-Wei A1 Kumar Yadav, Ruchi Ashok A1 Lin, Hong-Yu A1 Lee, Chien-Han A1 Lee, Chang-Chun YR 2024 SN 2377-5726 K1 Couplings K1 Thermal expansion K1 Moisture K1 Electromagnetic compatibility K1 Finite element analysis K1 Thermal analysis K1 Delamination K1 Wafer level packaging K1 Coefficient of thermal expansion K1 Wafer Warpage K1 epoxy molding compound K1 Finite Element Analysis K1 Reliability Analysis K1 hygrothermal Coupling SP 1599 OP 1602 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00261 DO https://doi.org/10.1109/ECTC51529.2024.00261 SF ELIB - SuUB Bremen
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