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1 Ergebnisse
1
Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polym..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Harish, Vineeth
;
Sahoo, Krutikesh
;
Zheng, Kai
... - p. 2178-2183 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00392
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polymer Build Up Films</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565150&Exemplar=1&LAN=DE A1 Harish, Vineeth A1 Sahoo, Krutikesh A1 Zheng, Kai A1 Park, Gilbert A1 Chen, Han-Wen A1 Verhaverbeke, Steven A1 Iyer, Subramanian S. YR 2024 SN 2377-5726 K1 Wiring K1 Silicon compounds K1 Fabrication K1 Force K1 Packaging K1 Routing K1 Dielectrics K1 Si-IF K1 ABF K1 Solder-Less Cu-Cu TCB K1 Advanced Packaging K1 Heterogeneous Integration SP 2178 OP 2183 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00392 DO https://doi.org/10.1109/ECTC51529.2024.00392 SF ELIB - SuUB Bremen
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