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1 Ergebnisse
1
Additively Manufactured RF Interconnects for D-Band/sub-THz..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Soto-Valle, Genaro
;
Roeske, Nikolas
;
Hu, Kexin
... - p. 698-703 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00393
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Additively Manufactured RF Interconnects for D-Band/sub-THz Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565154&Exemplar=1&LAN=DE A1 Soto-Valle, Genaro A1 Roeske, Nikolas A1 Hu, Kexin A1 Mensah, Yaw A. A1 Cressler, John D. A1 Tentzeris, Manos M. YR 2024 SN 2377-5726 K1 Fabrication K1 Geometry K1 Three-dimensional displays K1 Additives K1 Accuracy K1 Lithography K1 Three-dimensional printing K1 interconnects K1 wire bonding K1 micro additive manufacturing K1 millimeter wave K1 sub-THz K1 metal 3D printing SP 698 OP 703 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00393 DO https://doi.org/10.1109/ECTC51529.2024.00393 SF ELIB - SuUB Bremen
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