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1 Ergebnisse
1
3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With H..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Nicolas, Stephane
;
Suarez-Berru, Jerzy-Javier
;
Bresson, Nicolas
... - p. 305-311 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00057
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565164&Exemplar=1&LAN=DE A1 Nicolas, Stephane A1 Suarez-Berru, Jerzy-Javier A1 Bresson, Nicolas A1 Socquet-Clerc, Carole A1 Assous, Myriam A1 Borel, Stephan A1 Velard, Remi A1 Dechamp, Jerome A1 Bouis, Renan A1 Roman, Antonio A1 Abadie, Karine A1 Hebras, Damien YR 2024 SN 2377-5726 K1 Resistance K1 Fabrication K1 TV K1 Three-dimensional displays K1 Kelvin K1 Metals K1 CMOS image sensors K1 3D Integration K1 Hybrid Bonding K1 Fine pitch K1 High Density TSV K1 Wafer Level Packaging K1 Test Vehicle SP 305 OP 311 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00057 DO https://doi.org/10.1109/ECTC51529.2024.00057 SF ELIB - SuUB Bremen
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