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1 Ergebnisse
1
Enabling Die-to-Wafer Hybrid Bonding for the Next Generatio..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Hung, Raymond
;
See, Gilbert
;
Wang, Ying
... - p. 778-783 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00127
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Enabling Die-to-Wafer Hybrid Bonding for the Next Generation Advanced 3D Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565165&Exemplar=1&LAN=DE A1 Hung, Raymond A1 See, Gilbert A1 Wang, Ying A1 Yong, Chang Bum A1 Zheng, Ke A1 Chang, Yauloong A1 Shantaram, Avi A1 Wang, Ruiping A1 Sundarrajan, Arvind A1 Abdilla, Jonathan A1 Hegde, Nithyananda A1 Schmid, Stefan A1 Bikaljevic, Djuro A1 Glantschnig, Manfred YR 2024 SN 2377-5726 K1 Three-dimensional displays K1 Stacking K1 Semiconductor device reliability K1 Packaging K1 Plastics K1 Bonding K1 Plasma sources K1 Die to wafer Hybrid Bonding K1 high precision bonding K1 cleanliness K1 plasma activation K1 Wet Clean SP 778 OP 783 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00127 DO https://doi.org/10.1109/ECTC51529.2024.00127 SF ELIB - SuUB Bremen
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