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1 Ergebnisse
1
Measurement of the interfacial strength of thin metal film ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Ju, Young-Min
;
Um, Hui-Jin
;
Lee, Se-Min
... - p. 1260-1264 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00204
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Measurement of the interfacial strength of thin metal film by laser spallation method for advanced wafer level package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565166&Exemplar=1&LAN=DE A1 Ju, Young-Min A1 Um, Hui-Jin A1 Lee, Se-Min A1 Kim, Dukyong A1 Yoo, Woong-Kyoo A1 Lee, Daewoong A1 Hwang, Yeontaek A1 Lee, Seung Hwan A1 Kim, Hak-Sung YR 2024 SN 2377-5726 K1 Semiconductor device measurement K1 Laser theory K1 Propagation K1 Measurement by laser beam K1 Optical imaging K1 Plasmas K1 Laser ablation K1 thin-film K1 interfacial strength K1 laser spallation test K1 Michelson interferometer SP 1260 OP 1264 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00204 DO https://doi.org/10.1109/ECTC51529.2024.00204 SF ELIB - SuUB Bremen
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