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1 Ergebnisse
1
Development of Double Cantilever Beam Technique for Wafer-t..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Wei, Guohua
;
Gerber, Matthew
;
Rudd, Derik
... - p. 337-342 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00062
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Development of Double Cantilever Beam Technique for Wafer-to-Wafer Bond Energy Measurement</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565167&Exemplar=1&LAN=DE A1 Wei, Guohua A1 Gerber, Matthew A1 Rudd, Derik A1 Sibley, Robert A1 Nie, Pengfei A1 Battrell, Logan A1 Bayless, Andrew A1 Ireland, Sam A1 Fischer, Mark A1 Jain, Harsh A1 Canova, Kinsey A1 Markowitz, Dan A1 Palsulich, David YR 2024 SN 2377-5726 K1 Systematics K1 Measurement uncertainty K1 Energy measurement K1 Electronic components K1 Market research K1 Dielectric measurement K1 Dielectric films K1 Bond Energy K1 Double Cantilever Beam (DCB) K1 Fusion Bond K1 Hybrid Bond K1 Wafer-to-Wafer (W2W) SP 337 OP 342 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00062 DO https://doi.org/10.1109/ECTC51529.2024.00062 SF ELIB - SuUB Bremen
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