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1 Ergebnisse
1
Vertical Stacking of Heterogeneous Chiplets of Duplexer on ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Chong, Chai Tai
;
Rotaru, Mihai
;
Xiangyu, Wang
... - p. 2017-2023 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00344
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Vertical Stacking of Heterogeneous Chiplets of Duplexer on LNA/SOI</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565168&Exemplar=1&LAN=DE A1 Chong, Chai Tai A1 Rotaru, Mihai A1 Xiangyu, Wang A1 Pei Siang, Sharon Lim A1 Lin, Ji A1 Mandal, Rathin A1 Mani, Raju A1 Chinq, Jong Ming A1 Yong Liang, Ye YR 2024 SN 2377-5726 K1 Radio frequency K1 Couplings K1 Wireless communication K1 Three-dimensional displays K1 Frequency-domain analysis K1 Stacking K1 Layout K1 vertical stacking K1 heterogeneous K1 chiplets SP 2017 OP 2023 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00344 DO https://doi.org/10.1109/ECTC51529.2024.00344 SF ELIB - SuUB Bremen
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