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A study on D2W Hybrid Cu bonding Technology for HBM Multi-d..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lee, Hyeonmin
;
Kim, Jihoon
;
Kim, Min-Ki
... - p. 76-80 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00021
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565170&Exemplar=1&LAN=DE A1 Lee, Hyeonmin A1 Kim, Jihoon A1 Kim, Min-Ki A1 Lee, Wonil A1 Jang, Aeni A1 Lee, Hyuekjae A1 Kim, Dae-Woo YR 2024 SN 2377-5726 K1 Mass production K1 Temperature K1 Deformation K1 Semiconductor device reliability K1 Stacking K1 Memory management K1 Cleaning K1 HBM K1 CMP K1 Cu Pad Dishing K1 Cu-Cu Bonding K1 AFM K1 Hybrid Cu Bonding K1 BEOL structure SP 76 OP 80 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00021 DO https://doi.org/10.1109/ECTC51529.2024.00021 SF ELIB - SuUB Bremen
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