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1 Ergebnisse
1
Void Migration Kinetics in Fine Line Cu RDL under Electric ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Huang, Yen-Cheng
;
Tsai, Min-Yan
;
Lin, Ting-Chun
... - p. 576-580 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00097
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Void Migration Kinetics in Fine Line Cu RDL under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565176&Exemplar=1&LAN=DE A1 Huang, Yen-Cheng A1 Tsai, Min-Yan A1 Lin, Ting-Chun A1 Lin, Yung-Sheng A1 Wang, Chen-Chao A1 Hung, Chih-Pin A1 Lin, Kwang-Lung YR 2024 SN 2377-5726 K1 Electromigration K1 Grain boundaries K1 Surface resistance K1 Integrated circuit interconnections K1 Polyimides K1 Kinetic theory K1 Current density K1 Interconnect K1 Cu redistribution line (RDL) K1 Fan-out packaging K1 In-situ SEM K1 Void migration K1 Migration flux K1 Diffusion coefficient SP 576 OP 580 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00097 DO https://doi.org/10.1109/ECTC51529.2024.00097 SF ELIB - SuUB Bremen
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