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1 Ergebnisse
1
Novel three-layer stacking process with face-to-back CoW 6 ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Urata, Akihiro
;
Kamei, Takahiro
;
Sakamoto, Akihisa
... - p. 56-61 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00018
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Novel three-layer stacking process with face-to-back CoW 6 μm-pitch hybrid bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565180&Exemplar=1&LAN=DE A1 Urata, Akihiro A1 Kamei, Takahiro A1 Sakamoto, Akihisa A1 Yoshioka, Hirotaka A1 Hirano, Takaaki A1 Shimizu, Kan A1 Kagawa, Yoshihisa A1 Iwamoto, Hayato YR 2024 SN 2377-5726 K1 Electromigration K1 Three-dimensional displays K1 Stacking K1 Multichip modules K1 Process control K1 Electronic components K1 Cows K1 Chip on Wafer (CoW) bonding K1 Cu-Cu hybrid bonding K1 3D stacking K1 Face to Back SP 56 OP 61 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00018 DO https://doi.org/10.1109/ECTC51529.2024.00018 SF ELIB - SuUB Bremen
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