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1 Ergebnisse
1
Demystifying Edge Cases in Advanced IC Packaging Inspection..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Ghosh, Shajib
;
Roy, Antika
;
Al Hasan, Md Mahfuz
... - p. 2286-2293 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00388
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Demystifying Edge Cases in Advanced IC Packaging Inspection through Novel Explainable AI Metrics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565186&Exemplar=1&LAN=DE A1 Ghosh, Shajib A1 Roy, Antika A1 Al Hasan, Md Mahfuz A1 Craig, Patrick A1 Varshney, Nitin A1 Koppal, Sanjeev J. A1 Asadizanjani, Navid YR 2024 SN 2377-5726 K1 Semiconductor device measurement K1 Explainable AI K1 Image edge detection K1 Decision making K1 Electronic components K1 Packaging K1 Inspection K1 Advanced Packaging K1 Metrology K1 Physical Inspection K1 Edge Cases SP 2286 OP 2293 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00388 DO https://doi.org/10.1109/ECTC51529.2024.00388 SF ELIB - SuUB Bremen
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