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1 Ergebnisse
1
The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Yoon, Jiwon
;
Kwon, Youngsu
;
Kim, Hyunwoo
... - p. 1687-1693 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00279
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-Scale Advanced Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565189&Exemplar=1&LAN=DE A1 Yoon, Jiwon A1 Kwon, Youngsu A1 Kim, Hyunwoo A1 Lee, Juhyeon A1 Kim, Joungho A1 Kim, Sungjin A1 Jang, Heejun A1 Ahn, Kyun A1 Kim, Jinhan A1 Hwang, Taekyeong A1 Kim, Yi-Gyeong A1 Choi, Minseok YR 2024 SN 2377-5726 K1 Solid modeling K1 Three-dimensional displays K1 Design methodology K1 Computational modeling K1 Transfer functions K1 Bandwidth K1 Thermal analysis K1 high bandwidth memory K1 neural processing unit K1 heterogeneous integration K1 redistribution layer interposer K1 signal integrity K1 power integrity K1 thermal integrity SP 1687 OP 1693 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00279 DO https://doi.org/10.1109/ECTC51529.2024.00279 SF ELIB - SuUB Bremen
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