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1 Ergebnisse
1
Development of two different molding methods in 2.5D packag..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Saito, Takeshi
;
Ueno, Keiko
;
Kang, Dongchul
... - p. 1905-1910 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00322
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Development of two different molding methods in 2.5D package with 20 μm or less fine bump pitch CoW structure</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565201&Exemplar=1&LAN=DE A1 Saito, Takeshi A1 Ueno, Keiko A1 Kang, Dongchul A1 Iseki, Takahiro A1 Tsai, Shan Ho A1 Katoh, Sadaaki YR 2024 SN 2377-5726 K1 Semiconductor device measurement K1 Correlation K1 Liquids K1 Electronic components K1 Production K1 Cows K1 Electromagnetic compatibility K1 2.xD semiconductor package K1 narrow gap underfilling K1 wafer warpage K1 LCMUF K1 CUF K1 solid EMC SP 1905 OP 1910 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00322 DO https://doi.org/10.1109/ECTC51529.2024.00322 SF ELIB - SuUB Bremen
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