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Preparation of SAC305 Solder Specimens that mimic the Micro..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kim, You-Gwon
;
Kim, Heon-Su
;
Kim, Tae-Wan
... - p. 2261-2266 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00384
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565202&Exemplar=1&LAN=DE A1 Kim, You-Gwon A1 Kim, Heon-Su A1 Kim, Tae-Wan A1 Ryu, Seoung-Ung A1 Kim, Hak-Sung A1 Jang, Yong-Rae A1 Han, Bongtae A1 Lee, Jun-Hyeong A1 Kim, Jin-Kyu YR 2024 SN 2377-5726 K1 Temperature K1 Creep K1 Predictive models K1 Microelectronics K1 Microstructure K1 Reliability K1 Intermetallic K1 SAC305 K1 micro solder ball K1 Creep properties SP 2261 OP 2266 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00384 DO https://doi.org/10.1109/ECTC51529.2024.00384 SF ELIB - SuUB Bremen
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