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1
Impact of Non-Coplanarities on Microstructure and Propertie..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Amirnasiri, Ali
;
Sosa, Ramon A.
;
Tian, Mengkun
.. - p. 2298-2303 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00308
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Impact of Non-Coplanarities on Microstructure and Properties of Sintered NP-Cu Interconnections</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565208&Exemplar=1&LAN=DE A1 Amirnasiri, Ali A1 Sosa, Ramon A. A1 Tian, Mengkun A1 Antoniou, Antonia A1 Smet, Vanessa YR 2024 SN 2377-5726 K1 Temperature K1 Force K1 Sintering K1 Microstructure K1 Copper K1 Plastics K1 Bonding K1 Nanoporous-Cu interconnections K1 non-coplanarity tolerance K1 effect of sintering pressure K1 relative density K1 microstructure evolution SP 2298 OP 2303 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00308 DO https://doi.org/10.1109/ECTC51529.2024.00308 SF ELIB - SuUB Bremen
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