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1 Ergebnisse
1
High-Planarity, Ultra-Low-Temperature-Curable Photosensitiv..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Yoshizawa, Atsutaro
;
Asada, Akira
;
Matsukawa, Daisaku
. - p. 1382-1386 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00225
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>High-Planarity, Ultra-Low-Temperature-Curable Photosensitive Polyimide for Heterogeneous Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565225&Exemplar=1&LAN=DE A1 Yoshizawa, Atsutaro A1 Asada, Akira A1 Matsukawa, Daisaku A1 Tanabe, Takahiro YR 2024 SN 2377-5726 K1 Thermal expansion K1 Temperature K1 Semiconductor device reliability K1 Multichip modules K1 Polyimides K1 Materials reliability K1 Curing K1 Planarity K1 RDLs K1 Photosensitive K1 Low temperature curability K1 Low CTE SP 1382 OP 1386 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00225 DO https://doi.org/10.1109/ECTC51529.2024.00225 SF ELIB - SuUB Bremen
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