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1 Ergebnisse
1
Single and Multi NPU Chiplet Heterogeneous Integration pack..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kang, Lewis
;
Kim, Jay
;
Lee, Bruce
... - p. 1603-1608 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00262
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565226&Exemplar=1&LAN=DE A1 Kang, Lewis A1 Kim, Jay A1 Lee, Bruce A1 Park, Jade A1 Yu, Han Ju A1 Lee, Sung Hyuk A1 Lim, Jacinta Aman A1 Lee, Min Ji A1 Han, Seong Hwan A1 Lee, Jae Kyung A1 Hwang, Hailey YR 2024 SN 2377-5726 K1 Heating systems K1 Bridges K1 System-in-package K1 Multichip modules K1 Integrated circuit interconnections K1 Bridge circuits K1 Computer architecture K1 NPU K1 Chiplet K1 Heterogenous Integration K1 RDL interposer K1 Silicon bridge SP 1603 OP 1608 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00262 DO https://doi.org/10.1109/ECTC51529.2024.00262 SF ELIB - SuUB Bremen
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