I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 n..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Zhang, Boyao
;
Chew, Soon-Aik
;
Stucchi, Michele
... - p. 312-318 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00058
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565229&Exemplar=1&LAN=DE A1 Zhang, Boyao A1 Chew, Soon-Aik A1 Stucchi, Michele A1 Dewilde, Sven A1 Iacovo, Serena A1 Witters, Liesbeth A1 Webers, Tomas A1 Van Sever, Koen A1 De Vos, Joeri A1 Miller, Andy A1 Beyer, Gerald A1 Beyne, Eric YR 2024 SN 2377-5726 K1 Wafer bonding K1 Semiconductor device modeling K1 Three-dimensional displays K1 Surface resistance K1 Scalability K1 Process control K1 Vectors K1 W2W hybrid bonding K1 scaling K1 fine pitch K1 process development K1 wafer bonding overlay K1 electrical characterization SP 312 OP 318 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00058 DO https://doi.org/10.1109/ECTC51529.2024.00058 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
