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1 Ergebnisse
1
Through dielectric via etching in magnetic neutral loop dis..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Morikawa, Yasuhiro
;
Chen, Wei
- p. 1929-1933 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00327
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Through dielectric via etching in magnetic neutral loop discharge plasma for 3D chiplets interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565239&Exemplar=1&LAN=DE A1 Morikawa, Yasuhiro A1 Chen, Wei YR 2024 SN 2377-5726 K1 Fabrication K1 Three-dimensional displays K1 Magnetic multilayers K1 Process control K1 Nonhomogeneous media K1 Etching K1 Discharges (electric) K1 3D Chiplets K1 TDV K1 NLDplasma K1 Deep via etching SP 1929 OP 1933 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00327 DO https://doi.org/10.1109/ECTC51529.2024.00327 SF ELIB - SuUB Bremen
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