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1 Ergebnisse
1
Extremely Advanced Substrate as an integrated Package Solut..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kitamura, Tatsuya
;
Furukawa, Takeshi
;
Yamada, Shuhei
.. - p. 2053-2057 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00350
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Extremely Advanced Substrate as an integrated Package Solution (iPaS) for Next Generation High Performance Computing (HPC) applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565243&Exemplar=1&LAN=DE A1 Kitamura, Tatsuya A1 Furukawa, Takeshi A1 Yamada, Shuhei A1 Himeda, Koshi A1 Yamamoto, Atsushi YR 2024 SN 2377-5726 K1 Regulators K1 Power supplies K1 High performance computing K1 Capacitors K1 Capacitance K1 Topology K1 Polymers K1 power delivery network K1 embedded substrate K1 vertical power delivery K1 integrated voltage regulator SP 2053 OP 2057 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00350 DO https://doi.org/10.1109/ECTC51529.2024.00350 SF ELIB - SuUB Bremen
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