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1 Ergebnisse
1
Development of all-photonics-function embedded package subs..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Noriki, Akihiro
;
Uemura, Hirotaka
;
Kuwatsuka, Haruhiko
... - p. 96-100 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00025
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
Development of all-photonics-function embedded package substrate using 2.3D RDL interposer for co-packaged optics
UL https://suche.suub.uni-bremen.de/peid=ieee-10565245&Exemplar=1&LAN=DE A1 Noriki, Akihiro A1 Uemura, Hirotaka A1 Kuwatsuka, Haruhiko A1 Matsui, Naoki A1 Motoii, Reona A1 Maeda, Dan A1 Sugita, Tomoya A1 Nakamura, Fumi A1 Suda, Satoshi A1 Kurosu, Takayuki A1 Amano, Takeru YR 2024 SN 2377-5726 K1 Integrated optics K1 Power transmission lines K1 Simulation K1 Optical crosstalk K1 Electronic packaging thermal management K1 Thermal analysis K1 Optical reflection K1 co-packaged optics K1 polymer waveguide K1 silicon photonics K1 2.3DRDL interposer K1 thermal simulation K1 stripline SP 96 OP 100 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00025 DO https://doi.org/10.1109/ECTC51529.2024.00025 SF ELIB - SuUB Bremen
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