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1 Ergebnisse
1
Collective die-to-wafer assembly process for optically inte..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kennes, Koen
;
Dvoretskii, Anton
;
Podpod, Arnita
... - p. 1392-1397 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00227
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
Collective die-to-wafer assembly process for optically interconnected System-on-wafer
UL https://suche.suub.uni-bremen.de/peid=ieee-10565248&Exemplar=1&LAN=DE A1 Kennes, Koen A1 Dvoretskii, Anton A1 Podpod, Arnita A1 Xu, Pengfei A1 He, Junwen A1 Lepage, Guy A1 Golshani, Negin A1 Verheyen, Peter A1 Magdziak, Rafal A1 Bipul, Swetanshu A1 Phommahaxay, Alain A1 Chakrabarti, Maumita A1 Miller, Andy A1 Beyne, Eric A1 Ban, Yoojin A1 Ferraro, Filippo A1 van Campenhout, Joris YR 2024 SN 2377-5726 K1 Optical losses K1 Integrated optics K1 Optical interconnections K1 Accuracy K1 Optical device fabrication K1 Couplers K1 Optical coupling K1 Heterogeneous integration K1 wafer bonder K1 dielectric bonding K1 temporary bonding material K1 laser release material K1 evanescent coupling K1 PIC K1 optical interconnect SP 1392 OP 1397 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00227 DO https://doi.org/10.1109/ECTC51529.2024.00227 SF ELIB - SuUB Bremen
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