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Collective die-to-wafer assembly process for optically inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Kennes, Koen ; Dvoretskii, Anton ; Podpod, Arnita... - p. 1392-1397 , 2024

Link: https://doi.org/10.1109/ECTC51529.2024.00227

RT 
T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Collective die-to-wafer assembly process for optically interconnected System-on-wafer</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10565248&Exemplar=1&LAN=DE
				
A1 Kennes, Koen
A1 Dvoretskii, Anton
A1 Podpod, Arnita
A1 Xu, Pengfei
A1 He, Junwen
A1 Lepage, Guy
A1 Golshani, Negin
A1 Verheyen, Peter
A1 Magdziak, Rafal
A1 Bipul, Swetanshu
A1 Phommahaxay, Alain
A1 Chakrabarti, Maumita
A1 Miller, Andy
A1 Beyne, Eric
A1 Ban, Yoojin
A1 Ferraro, Filippo
A1 van Campenhout, Joris
YR 2024
SN 2377-5726
K1 Optical losses
K1 Integrated optics
K1 Optical interconnections
K1 Accuracy
K1 Optical device fabrication
K1 Couplers
K1 Optical coupling
K1 Heterogeneous integration
K1 wafer bonder
K1 dielectric bonding
K1 temporary bonding material
K1 laser release material
K1 evanescent coupling
K1 PIC
K1 optical interconnect
SP 1392
OP 1397
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00227
DO https://doi.org/10.1109/ECTC51529.2024.00227
SF ELIB - SuUB Bremen

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