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1 Ergebnisse
1
Analysis of Thin Flip Chip Chip-Scale Package Warpage Cause..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Foong, CS
;
Afripin, Amirul
;
Lakhera, Nishant
. - p. 1286-1292 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00209
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Analysis of Thin Flip Chip Chip-Scale Package Warpage Causes and Variations</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565249&Exemplar=1&LAN=DE A1 Foong, CS A1 Afripin, Amirul A1 Lakhera, Nishant A1 Uehling, Trent YR 2024 SN 2377-5726 K1 Semiconductor device measurement K1 Uncertainty K1 Electronic components K1 Production K1 Metrology K1 Finite element analysis K1 Flip-chip devices K1 FCCSP K1 warpage K1 coplanarity K1 FEA K1 experimental validation K1 and variability characterization SP 1286 OP 1292 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00209 DO https://doi.org/10.1109/ECTC51529.2024.00209 SF ELIB - SuUB Bremen
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