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1 Ergebnisse
1
Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Choi, Kwang-Seong
;
Joo, Jiho
;
Choi, Gwang-Mun
... - p. 943-948 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00153
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565251&Exemplar=1&LAN=DE A1 Choi, Kwang-Seong A1 Joo, Jiho A1 Choi, Gwang-Mun A1 Shin, Jungho A1 Lee, Chanmi A1 Jang, Ki-Seok A1 Oh, Jin-Hyuk A1 Yun, Ho-Gyeong A1 Moon, Seok Hwan A1 Jung, Ji Eun A1 Lee, Gaeun A1 Eom, Yong-Sung YR 2024 SN 2377-5726 K1 Surface cleaning K1 Temperature K1 Accuracy K1 Lasers K1 Process control K1 Surface emitting lasers K1 Cows K1 chiplet integration K1 room temperature K1 bump reflow K1 water-soluble laser epoxy flux K1 Laser-Assisted Bonding with Compression (LABC) K1 laser NCF K1 20μm pitch SP 943 OP 948 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00153 DO https://doi.org/10.1109/ECTC51529.2024.00153 SF ELIB - SuUB Bremen
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