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1 Ergebnisse
1
Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Chen, Yu-An
;
Ong, Jia-Juen
;
Chiu, Wei-Lan
... - p. 399-403 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00071
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hydrophilicity Enhancement with NaOH for Chip-to-wafer Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565254&Exemplar=1&LAN=DE A1 Chen, Yu-An A1 Ong, Jia-Juen A1 Chiu, Wei-Lan A1 Hsu, Wei-You A1 Yang, Shih-Chi A1 Chang, Hsiang-Hung A1 Chen, Chih YR 2024 SN 2377-5726 K1 Silicon compounds K1 Temperature measurement K1 Scanning electron microscopy K1 Annealing K1 Transmission electron microscopy K1 Surface roughness K1 Rough surfaces K1 3D IC integration K1 chip-to-wafer bonding K1 Cu/SiOi hybrid bonding K1 low-temperature bonding K1 interfacial analysis SP 399 OP 403 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00071 DO https://doi.org/10.1109/ECTC51529.2024.00071 SF ELIB - SuUB Bremen
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