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1 Ergebnisse
1
A Novel FOPLP Structure with Chip First & RDL First Process..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Wang, Terry
;
Lu, Chih Wei
;
Feng, Eric
... - p. 1868-1871 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00313
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565264&Exemplar=1&LAN=DE A1 Wang, Terry A1 Lu, Chih Wei A1 Feng, Eric A1 Yang, Yu-Jhen A1 Chang, Cheng-Yueh A1 Cheng, Pei-Pei A1 Lie, Fredrick A1 Cheng, Austin A1 Huang, Hsin-Yi A1 Koh, Meiten A1 Wiatrowska, Aneta A1 Witczak, Lukasz YR 2024 SN 2377-5726 K1 Printing K1 Mass production K1 Lithography K1 Integrated circuit interconnections K1 Glass K1 Packaging K1 Market research K1 FOPLP K1 RDL K1 DLT K1 DDC K1 Edge printing SP 1868 OP 1871 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00313 DO https://doi.org/10.1109/ECTC51529.2024.00313 SF ELIB - SuUB Bremen
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