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1 Ergebnisse
1
High Density Integration of Silicon Photonic Chiplets for 5..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kannan, Sukeshwar
;
Chang, Ray
;
Potluri, Hari
... - p. 81-84 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00022
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>High Density Integration of Silicon Photonic Chiplets for 51.2T Co-packaged Optics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565267&Exemplar=1&LAN=DE A1 Kannan, Sukeshwar A1 Chang, Ray A1 Potluri, Hari A1 Zhang, Sheng A1 Li, Jay A1 Xu, Bruce A1 Hsu, Hsi-Chang YR 2024 SN 2377-5726 K1 Integrated optics K1 Industries K1 Optical switches K1 Prototypes K1 Electronic components K1 Bandwidth K1 Silicon photonics K1 photonics components K1 silicon photonics K1 3D packaging K1 heterogeneous integration K1 interconnects for thermo-compression bonding K1 assembly K1 co-packaged optics SP 81 OP 84 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00022 DO https://doi.org/10.1109/ECTC51529.2024.00022 SF ELIB - SuUB Bremen
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