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1 Ergebnisse
1
A Study on Improvement and Extension of Fine-Pitch Micro-Bu..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Ahn, Seok-Geun
;
Oh, Ju-Hyeon
;
Jeon, Gwang-Jae
.. - p. 556-562 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00094
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Study on Improvement and Extension of Fine-Pitch Micro-Bump Interconnects Technology: New Metallurgy & Flux-Less Oxide-removal Laser Assembly (FLOLA)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565273&Exemplar=1&LAN=DE A1 Ahn, Seok-Geun A1 Oh, Ju-Hyeon A1 Jeon, Gwang-Jae A1 Lee, Dae-Ho A1 Lee, Seok-Hyun YR 2024 SN 2377-5726 K1 Electronics industry K1 Multichip modules K1 Aging K1 Laser stability K1 Cleaning K1 Metallurgy K1 Copper K1 heterogeneous integration K1 chiplet K1 micro-bump interconnect K1 diffusion barrier K1 plasma treatment K1 intermetallic compound K1 flux-less bonding K1 iso-thermal aging SP 556 OP 562 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00094 DO https://doi.org/10.1109/ECTC51529.2024.00094 SF ELIB - SuUB Bremen
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