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1 Ergebnisse
1
Packaging Challenges and Solutions for Next Generation Low-..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Tang, Humi Shih-Wen
;
Li, Jerry Che-Han
;
Huang, Leo Hsin-Hung
... - p. 2083-2090 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00355
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Packaging Challenges and Solutions for Next Generation Low-Profile WLCSP</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565275&Exemplar=1&LAN=DE A1 Tang, Humi Shih-Wen A1 Li, Jerry Che-Han A1 Huang, Leo Hsin-Hung A1 Wei, Jessie Yu-Shan A1 Belonio, Jesus Mennen A1 Canete, Baltazar YR 2024 SN 2377-5726 K1 Power system management K1 Semiconductor device reliability K1 Lasers K1 Resists K1 Sawing K1 Internet of Things K1 Soldering K1 Thin WLCSP package challenges K1 Low Profile K1 Thin Die K1 Grinding Process Optimization K1 Warpage Handling K1 De-Taping Process Optimization K1 Laser Marking Recipe K1 Dicing Parameter K1 Ball Placement K1 Package Level Reliability Test K1 Board Level Reliability Test SP 2083 OP 2090 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00355 DO https://doi.org/10.1109/ECTC51529.2024.00355 SF ELIB - SuUB Bremen
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