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1 Ergebnisse
1
Liquid Surface Tension-Driven Chip Self-Assembly Technology..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Zehua, Du
;
Kikuchi, Hiroshi
;
Hishinuma, Hayato
... - p. 1335-1341 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00217
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565276&Exemplar=1&LAN=DE A1 Zehua, Du A1 Kikuchi, Hiroshi A1 Hishinuma, Hayato A1 Murugesan, Mariappan A1 Tanaka, Tetsu A1 Fukushima, Takafumi YR 2024 SN 2377-5726 K1 Semiconductor device measurement K1 Accuracy K1 Liquids K1 Self-assembly K1 Three-dimensional displays K1 Stacking K1 Throughput K1 self-assembly K1 hybrid bonding K1 3D integration K1 DRAM stacking K1 liquid surface tension K1 and HBM SP 1335 OP 1341 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00217 DO https://doi.org/10.1109/ECTC51529.2024.00217 SF ELIB - SuUB Bremen
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