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1 Ergebnisse
1
Study of fabrication and reliability for 120 mm x 120 mm ex..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Hirano, Kazue
;
Kang, Dongchul
;
Takahashi, Masaki
... - p. 955-962 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00155
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Study of fabrication and reliability for 120 mm x 120 mm extremely large advanced 2.5D package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565278&Exemplar=1&LAN=DE A1 Hirano, Kazue A1 Kang, Dongchul A1 Takahashi, Masaki A1 Iseki, Takahiro A1 Murai, Kosuke A1 Katoh, Sadaaki YR 2024 SN 2377-5726 K1 TV K1 Simulation K1 Bandwidth K1 Electronic packaging thermal management K1 Thermal conductivity K1 Silicon K1 Reliability K1 2.5D package K1 Large substrate K1 Warpage K1 Reliability test (key words) SP 955 OP 962 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00155 DO https://doi.org/10.1109/ECTC51529.2024.00155 SF ELIB - SuUB Bremen
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