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1 Ergebnisse
1
Advanced Thermocompression Bonding on High Density Fan-Out ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Wudjud, Wiwy
;
Lin, ShuYu
;
Chang, Yungshun
... - p. 929-935 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00151
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Advanced Thermocompression Bonding on High Density Fan-Out Embedded Bridge Technology for HPC/AI/ML Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565281&Exemplar=1&LAN=DE A1 Wudjud, Wiwy A1 Lin, ShuYu A1 Chang, Yungshun A1 Yen, Jean A1 Liao, Reno A1 Cheng, LeoHS A1 Wu, Yihsien A1 Huang, Simon YL A1 Chen, Jui Tzu A1 Lee, ChengYu A1 Huang, JoeyCl A1 Cao, Lihong YR 2024 SN 2377-5726 K1 Bridges K1 Scanning electron microscopy K1 Thermal expansion K1 TV K1 Metallization K1 Packaging K1 Thermal conductivity K1 thermocompression bonding (TCB) K1 fan-out-chip on-substrate-embedded bridge (FOCoS-Bridge) K1 backside metallization (BSM) K1 high performance computing (HPC) K1 chiplet integration SP 929 OP 935 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00151 DO https://doi.org/10.1109/ECTC51529.2024.00151 SF ELIB - SuUB Bremen
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