I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Du, Leiming ; van Zeijl, Henk... - p. 1891-1895 , 2024
Link: https://doi.org/10.1109/ECTC51529.2024.00221