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1 Ergebnisse
1
Quantifying the Electrical Impact of Bonding Misalignment f..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Ryan, Kevin
;
Ip, Nathan
;
Netzband, Christopher
... - p. 1329-1334 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00216
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Quantifying the Electrical Impact of Bonding Misalignment for 0.5 μm Pitch Hybrid Bonding Structures</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10565289&Exemplar=1&LAN=DE A1 Ryan, Kevin A1 Ip, Nathan A1 Netzband, Christopher A1 Chien, Kun-Chieh A1 Tuchman, Andrew A1 Huang, Jason A1 LeFevre, Scott A1 Son, Ilseok A1 Aizawa, Hirokazu A1 Maekawa, Kaoru YR 2024 SN 2377-5726 K1 Resistance K1 Analytical models K1 Systematics K1 Sensitivity K1 Area measurement K1 Electronic components K1 Packaging K1 Cu hybrid bonding K1 contact resistivity K1 fine pitch K1 heterogeneous integration K1 wafer-to-wafer (W2W) K1 face-to-face K1 3D advanced packaging SP 1329 OP 1334 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00216 DO https://doi.org/10.1109/ECTC51529.2024.00216 SF ELIB - SuUB Bremen
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