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1 Ergebnisse
1
Thermal Network Modeling of Heat Dissipation Structure of P..:
, In:
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
,
Shi, Xingjian
;
Yu, Bin
;
Wu, Qiang
... - p. 3759-3764 , 2024
Link:
https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567..
RT T1 <cTitle>2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)</cTitle>: T1 <Title>Thermal Network Modeling of Heat Dissipation Structure of Power Devices with PCM to Enhancing Short-Term Overload Capacity</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10567348&Exemplar=1&LAN=DE A1 Shi, Xingjian A1 Yu, Bin A1 Wu, Qiang A1 Hai, Dong A1 Luo, Haoze A1 Li, Wuhua A1 He, Xiangning YR 2024 K1 Heating systems K1 Phase change materials K1 Power supplies K1 Interference K1 Electronic packaging thermal management K1 Thermal conductivity K1 Power electronics K1 Thermal Network model K1 PCM K1 Power Device K1 Short-Term Overload Capacity SP 3759 OP 3764 LK http://dx.doi.org/https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567348 DO https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567348 SF ELIB - SuUB Bremen
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