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1 Ergebnisse
1
New Standard-under-Development for Chiplet Interconnect Tes..:
, In:
2024 IEEE European Test Symposium (ETS)
,
Marinissen, Erik Jan
;
Evans, Adrian
;
Chuang, Po-Yao
.. - p. 1-10 , 2024
Link:
https://doi.org/10.1109/ETS61313.2024.10567355
RT T1
2024 IEEE European Test Symposium (ETS)
: T1
New Standard-under-Development for Chiplet Interconnect Test and Repair: IEEE Std P3405
UL https://suche.suub.uni-bremen.de/peid=ieee-10567355&Exemplar=1&LAN=DE A1 Marinissen, Erik Jan A1 Evans, Adrian A1 Chuang, Po-Yao A1 Keim, Martin A1 Chandra, Anshuman YR 2024 SN 1558-1780 K1 Protocols K1 Codes K1 Terminology K1 Europe K1 Maintenance engineering K1 Packaging K1 IEEE Standards SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/ETS61313.2024.10567355 DO https://doi.org/10.1109/ETS61313.2024.10567355 SF ELIB - SuUB Bremen
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