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1 Ergebnisse
1
Calibration and Thermal Characterization of Multi-Chip SiC ..:
, In:
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
,
Saeidi, Mahmoud
;
Friebe, Jens
;
Zacharias, Peter
- p. 5105-5108 , 2024
Link:
https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567..
RT T1 <cTitle>2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)</cTitle>: T1 <Title>Calibration and Thermal Characterization of Multi-Chip SiC Power Modules: Challenges and Approaches</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10567376&Exemplar=1&LAN=DE A1 Saeidi, Mahmoud A1 Friebe, Jens A1 Zacharias, Peter YR 2024 K1 Temperature measurement K1 Thermal management of electronics K1 Temperature sensors K1 Semiconductor device measurement K1 Temperature K1 Voltage measurement K1 Silicon carbide K1 Multi-Chip Power Semiconductor K1 Junction Temperature K1 Thermal Simulation K1 Thermal Calibration K1 Thermal Management SP 5105 OP 5108 LK http://dx.doi.org/https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567376 DO https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567376 SF ELIB - SuUB Bremen
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