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1 Ergebnisse
1
Investigation on reproduction of IGBT die-attach solder deg..:
, In:
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
,
Wei, Yilei
;
Yang, Xin
;
Wu, Xinlong
.. - p. 4684-4689 , 2024
Link:
https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567..
RT T1 <cTitle>2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)</cTitle>: T1 <Title>Investigation on reproduction of IGBT die-attach solder degradation with finite element thermal-mechanical simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10567397&Exemplar=1&LAN=DE A1 Wei, Yilei A1 Yang, Xin A1 Wu, Xinlong A1 Zhao, Shihan A1 Liu, Guoyou YR 2024 K1 Insulated gate bipolar transistors K1 Simulation K1 Microscopy K1 Creep K1 Packaging K1 Power electronics K1 Finite element analysis K1 die-attach solder K1 finite element simulation K1 IGBT module SP 4684 OP 4689 LK http://dx.doi.org/https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567397 DO https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567397 SF ELIB - SuUB Bremen
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