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1 Ergebnisse
1
A Fast Steady-state Thermal Modeling of Power Modules Based..:
, In:
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
,
Zhou, Jiajun
;
Cui, Hongchang
;
Wnag, Laili
... - p. 1825-1829 , 2024
Link:
https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567..
RT T1 <cTitle>2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)</cTitle>: T1 <Title>A Fast Steady-state Thermal Modeling of Power Modules Based on Fourier Analytic Series</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10567496&Exemplar=1&LAN=DE A1 Zhou, Jiajun A1 Cui, Hongchang A1 Wnag, Laili A1 Gan, Yongmei A1 Tang, Zijie A1 Gao, Kai YR 2024 K1 Couplings K1 Analytical models K1 Thermal resistance K1 Computational modeling K1 Layout K1 Multichip modules K1 Thermal analysis K1 Fourier series K1 analytic model K1 structure simplification K1 thermal coupling SP 1825 OP 1829 LK http://dx.doi.org/https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567496 DO https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567496 SF ELIB - SuUB Bremen
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