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1 Ergebnisse
1
Electro-Thermal Digital Twin for GaN eHEMT Power Modules Te..:
, In:
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
,
Sun, Zhongchao
;
Takahashi, Masaki
;
Guo, Wendi
.. - p. 4032-4037 , 2024
Link:
https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567..
RT T1 <cTitle>2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)</cTitle>: T1 <Title>Electro-Thermal Digital Twin for GaN eHEMT Power Modules Temperature Characterization during Power Cycling Tests</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10567565&Exemplar=1&LAN=DE A1 Sun, Zhongchao A1 Takahashi, Masaki A1 Guo, Wendi A1 Munk-Nielsen, Stig A1 Jorgensen, Asger Bjorn YR 2024 K1 Degradation K1 Temperature distribution K1 Thermomechanical processes K1 Multichip modules K1 Predictive models K1 Digital twins K1 Numerical models K1 Digital twin K1 Electro-thermal K1 Power cycling K1 Temperature characterization SP 4032 OP 4037 LK http://dx.doi.org/https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567565 DO https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10567565 SF ELIB - SuUB Bremen
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