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1 Ergebnisse
1
Three-dimensional Thermal Modeling Method of Power Device C..:
, In:
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
,
Liu, Yi
;
Yuan, Shuoxun
;
Zhang, Jin
... - p. 1625-1628 , 2024
Link:
https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10568..
RT T1 <cTitle>2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)</cTitle>: T1 <Title>Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10568029&Exemplar=1&LAN=DE A1 Liu, Yi A1 Yuan, Shuoxun A1 Zhang, Jin A1 Zhang, Zhewei A1 Zhang, Lei A1 Gong, Hongzhou A1 Wang, Laili A1 Gao, Kai YR 2024 K1 Temperature distribution K1 Solid modeling K1 Neural networks K1 Thermal management K1 Finite element analysis K1 Reliability K1 Junctions K1 Three dimensional K1 finite element analysis K1 long short term memory K1 transient temperature distribution SP 1625 OP 1628 LK http://dx.doi.org/https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10568029 DO https://doi.org/10.1109/IPEMC-ECCEAsia60879.2024.10568029 SF ELIB - SuUB Bremen
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