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Integration of a Miniature Multichannel Laser Diode Chip to..:
, In:
2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
,
Vlasov, Aleksandr
;
Lehtinen, Santeri
;
Lepukhov, Evgenii
... - p. 1-5 , 2024
Link:
https://doi.org/10.23919/NordPac61094.2024.10582269
RT T1 <cTitle>2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)</cTitle>: T1 <Title>Integration of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit Using Laser-Assisted Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10582269&Exemplar=1&LAN=DE A1 Vlasov, Aleksandr A1 Lehtinen, Santeri A1 Lepukhov, Evgenii A1 Virtanen, Heikki A1 Ojanen, Samu-Pekka A1 Viheriala, Jukka A1 Guina, Mircea YR 2024 K1 Surface impedance K1 Rapid thermal processing K1 Surface waves K1 Process control K1 Silicon photonics K1 Bonding K1 Surface treatment K1 assembly processes K1 laser-assisted bonding K1 photonic integration K1 silicon devices K1 silicon photonics K1 through-silicon vision K1 infrared imaging K1 infrared microscopy SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/NordPac61094.2024.10582269 DO https://doi.org/10.23919/NordPac61094.2024.10582269 SF ELIB - SuUB Bremen
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