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1 Ergebnisse
1
A Low-Loss DC-to-300 GHz InP/Si Interconnection Based on Wa..:
, In:
2024 IEEE/MTT-S International Microwave Symposium - IMS 2024
,
Araki, Yusuke
;
Shiratori, Yuta
;
Hamada, Hiroshi
... - p. 816-819 , 2024
Link:
https://doi.org/10.1109/IMS40175.2024.10600247
RT T1 <cTitle>2024 IEEE/MTT-S International Microwave Symposium - IMS 2024</cTitle>: T1 <Title>A Low-Loss DC-to-300 GHz InP/Si Interconnection Based on Wafer Level Packaging Using Chip-first/Facedown Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10600247&Exemplar=1&LAN=DE A1 Araki, Yusuke A1 Shiratori, Yuta A1 Hamada, Hiroshi A1 Muto, Miwa A1 Abdo, Ibrahim A1 Jyo, Teruo A1 Nakajima, Fumito YR 2024 SN 2576-7216 K1 Semiconductor device measurement K1 Microwave technology K1 Insertion loss K1 Packaging K1 Loss measurement K1 Reflection K1 Coplanar waveguides K1 sub-terahertz (sub-THz) K1 interconnect K1 wafer level packaging (WLP) K1 InP K1 Si K1 re-distribution layer (RDL) SP 816 OP 819 LK http://dx.doi.org/https://doi.org/10.1109/IMS40175.2024.10600247 DO https://doi.org/10.1109/IMS40175.2024.10600247 SF ELIB - SuUB Bremen
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