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Occurrence of Voids in Soldered Joints for Electrical Engin..:
, In:
2024 47th International Spring Seminar on Electronics Technology (ISSE)
,
Chvosta, Tomas
;
Dusek, Karel
;
Gurcik, Tomas
- p. 1-5 , 2024
Link:
https://doi.org/10.1109/ISSE61612.2024.10603930
RT T1 <cTitle>2024 47th International Spring Seminar on Electronics Technology (ISSE)</cTitle>: T1 <Title>Occurrence of Voids in Soldered Joints for Electrical Engineering</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10603930&Exemplar=1&LAN=DE A1 Chvosta, Tomas A1 Dusek, Karel A1 Gurcik, Tomas YR 2024 SN 2161-2536 K1 Electrical engineering K1 Vibrations K1 Seminars K1 Pins K1 Manufacturing K1 Springs K1 Soldering K1 Lead-free soldering K1 solder paste K1 Ball Grid Array K1 X-ray analysis SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ISSE61612.2024.10603930 DO https://doi.org/10.1109/ISSE61612.2024.10603930 SF ELIB - SuUB Bremen
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