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1 Ergebnisse
1
Transmission Line Designs on Glass-Embedded Fan Out Antenna..:
, In:
2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
,
Liu, Yu-Chen
;
Lwo, Ben-Je
;
Chung, Tai-Chiang
- p. 1-4 , 2024
Link:
https://doi.org/10.1109/DTIP62575.2024.10613075
RT T1 <cTitle>2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)</cTitle>: T1 <Title>Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10613075&Exemplar=1&LAN=DE A1 Liu, Yu-Chen A1 Lwo, Ben-Je A1 Chung, Tai-Chiang YR 2024 SN 2768-1874 K1 Fans K1 Power transmission lines K1 5G mobile communication K1 Bandwidth K1 Packaging K1 Gain K1 Antenna arrays K1 5G K1 Fan-Out Antenna in Packaging K1 array antenna K1 Glass embedded FO _ AiP K1 transmission line design SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/DTIP62575.2024.10613075 DO https://doi.org/10.1109/DTIP62575.2024.10613075 SF ELIB - SuUB Bremen
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