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1 Ergebnisse
1
First Demonstration of Monolithic Three-Dimensional Integra..:
, In:
2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Liu, Menggan
;
Li, Zhi
;
Lu, Wendong
... - p. 1-2 , 2024
Link:
https://doi.org/10.1109/VLSITechnologyandCir46783.2024..
RT T1 <cTitle>2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>First Demonstration of Monolithic Three-Dimensional Integration of Ultra-High Density Hybrid IGZO/Si SRAM and IGZO 2T0C DRAM Achieving Record-Low Latency (5000s)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10631551&Exemplar=1&LAN=DE A1 Liu, Menggan A1 Li, Zhi A1 Lu, Wendong A1 Chen, Kaifei A1 Niu, Jiebin A1 Liao, Fuxi A1 Wu, Zijing A1 Lu, Congyan A1 Li, Wei zeng A1 Geng, Di A1 Lu, Nianduan A1 Dou, Chunmeng A1 Yang, Guanhua A1 Li, Ling A1 Liu, Ming YR 2024 SN 2158-9682 K1 Three-dimensional displays K1 Random access memory K1 Very large scale integration K1 Logic gates K1 Data transfer K1 Hybrid power systems K1 Inverters SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSITechnologyandCir46783.2024.10631551 DO https://doi.org/10.1109/VLSITechnologyandCir46783.2024.10631551 SF ELIB - SuUB Bremen
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