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A leadless packaging concept for high frequency application:

, In: 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546),
Theuss, H. ; Weigel, R. ; Dangelmaier, J.... - p. 1851-1854 Vol.2 , 2004
Link: https://doi.org/10.1109/ECTC.2004.1320371